The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2014

Filed:

Feb. 08, 2010
Applicants:

Hideki Hirotsuru, Omuta, JP;

Satoshi Higuma, Omuta, JP;

Shinya Narita, Omuta, JP;

Yoshihiko Tsujimura, Tokyo, JP;

Inventors:

Hideki Hirotsuru, Omuta, JP;

Satoshi Higuma, Omuta, JP;

Shinya Narita, Omuta, JP;

Yoshihiko Tsujimura, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); C04B 41/88 (2006.01); H05K 1/05 (2006.01); C04B 41/51 (2006.01); H01L 23/373 (2006.01); H01L 23/14 (2006.01); C04B 41/00 (2006.01); B22F 3/26 (2006.01); C04B 111/00 (2006.01);
U.S. Cl.
CPC ...
C04B 41/88 (2013.01); H05K 1/05 (2013.01); C04B 41/5155 (2013.01); H01L 23/3735 (2013.01); H05K 2201/0323 (2013.01); H01L 23/142 (2013.01); H01L 23/373 (2013.01); H01L 33/641 (2013.01); C04B 2111/00844 (2013.01); C04B 41/009 (2013.01); B22F 3/26 (2013.01);
Abstract

A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 μm; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 μm, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×10to 7.5×10/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.3, and a three-point bending strength of 50-150 MPa.


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