The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2014

Filed:

Jun. 18, 2013
Applicant:

H.c. Starck Inc., Newton, MA (US);

Inventors:

Steven A. Miller, Canton, MA (US);

Prabhat Kumar, Framingham, MA (US);

Rong-chein Richard Wu, North Chelmsford, MA (US);

Shuwei Sun, Framingham, MA (US);

Stefan Zimmermann, Bad Saeckingen, DE;

Olaf Schmidt-Park, Needham, MA (US);

Assignees:

H.C. Starck Inc., Newton, MA (US);

H.C. Starck GmbH, Goslar, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 1/02 (2006.01); C23C 4/12 (2006.01); C23C 14/34 (2006.01); C22C 1/04 (2006.01); B22F 1/00 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); C23C 4/127 (2013.01); C22C 1/045 (2013.01); B22F 1/0014 (2013.01);
Abstract

In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and comprising a sputtering-target material is provided, the sputtering-target material (i) comprising a metal, (ii) defining a recessed furrow therein, and (iii) having a first grain size and a first crystalline microstructure. A powder is spray-deposited within the furrow to form a layer therein, the layer (i) comprising the metal, (ii) having a second grain size finer than the first grain size, and (iii) having a second crystalline microstructure more random than the first crystalline microstructure. Spray-depositing the powder within the furrow forms a distinct boundary line between the layer and the sputtering-target material.


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