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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8883025 B1

PDFFull Text
Date of Patent:
Nov. 11, 2014

Filed:

May. 25, 2011

Plasma processing apparatus and plasma processing method

Applicants:

Shogo Okita, Hyogo, JP;

Yasuhiro Onishi, Osaka, JP;

Inventors:

Shogo Okita, Hyogo, JP;

Yasuhiro Onishi, Osaka, JP;

Assignee:

Panasonic Corporation, Osaka, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Anita Alanko

Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/677 (2006.01); H01J 37/32 (2006.01); B44C 1/22 (2006.01); H05H 1/46 (2006.01);
U.S. Cl.
CPC ...
B44C 1/227 (2013.01); H01L 21/6831 (2013.01); H01L 21/681 (2013.01); H01L 21/67109 (2013.01); H01L 21/68742 (2013.01); H01L 21/68771 (2013.01); H01L 21/67742 (2013.01); H05H 2001/4675 (2013.01); H01L 21/68764 (2013.01); H01J 37/32779 (2013.01); H01L 21/68707 (2013.01); H01L 21/67754 (2013.01); Y10S 438/973 (2013.01);
Abstract

A plasma processing apparatus includes a stock unit, a processing unit, and an alignment chamber. The stock unit supplies and collects a conveyable tray formed with a plurality of housing holes in each of which a wafer is housed. In the processing chamber, plasma processing is executed on the wafers housed in the tray supplied from the stock unit. The alignment chamber is provided with a rotating table on which the tray before being subjected to the plasma processing is set to perform positioning of the wafers on the rotating table. A housing state determination unit of a control device determines whether or not the wafer is misaligned with respect the housing hole of the tray based on a height detected by height detecting sensors.

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Okita, Shogo. (2014). Plasma processing apparatus and plasma processing method (U.S. Patent No. 8883025). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8883025

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