The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
Dec. 09, 2009
Kazuyuki Misumi, Tokyo, JP;
Hideyuki Arakawa, Tokyo, JP;
Shunji Yamauchi, Tokyo, JP;
Mitsuru Aoki, Tokyo, JP;
Kazuyuki Misumi, Tokyo, JP;
Hideyuki Arakawa, Tokyo, JP;
Shunji Yamauchi, Tokyo, JP;
Mitsuru Aoki, Tokyo, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Abstract
An improvement in the quality of wire bonding is achieved by reducing the vibration of a lead frame or a wiring substrate after wire bonding. Over a heat block in a wire bond portion of a wire bonder, there is provided a cooling blower for cooling a wire-bonded matrix frame so that the temperature thereof may decrease stepwise. After wire bonding, cold air is blown from the cooling blower to the matrix frame, and temperature control of the matrix frame is performed so that the temperature of the matrix frame after wire bonding may decrease stepwise. Or, the wire-bonded matrix frame is fixed with a holding tool such as a frame holding member, a guide member, a roller means, or an elastic means until cooling is completed.