The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Aug. 30, 2007
Chien-chung Huang, Hsin-Chu, TW;
Chui-chung Chiu, Tainwei Township, TW;
Szu-chin Chen, Hsin-Chu, TW;
Hui-chun Kuo, Hsin-Chu, TW;
Chien-Chung Huang, Hsin-Chu, TW;
Chui-Chung Chiu, Tainwei Township, TW;
Szu-Chin Chen, Hsin-Chu, TW;
Hui-Chun Kuo, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method, computer-readable medium, and semiconductor device for securing integrated engineering analysis are provided. A die ID is generated from a lot ID, wafer ID, die coordinates, or other product information. The die ID is encrypted with a key and written to the die. The encryption key and encrypted die ID may be stored in a secure storage. A die is fabricated with an encryption module and an unencrypted die ID. The encryption module is provided with an unencrypted die ID, encrypts the unencrypted die ID, and writes the encrypted die ID to a die fuse.