The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2014

Filed:

Sep. 19, 2011
Applicants:

Zheng John YE, Santa Clara, CA (US);

Kartik Ramaswamy, San Jose, CA (US);

Troy S. Detrick, Los Altos, CA (US);

Kenneth S. Collins, San Jose, CA (US);

Inventors:

Zheng John Ye, Santa Clara, CA (US);

Kartik Ramaswamy, San Jose, CA (US);

Troy S. Detrick, Los Altos, CA (US);

Kenneth S. Collins, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 25/72 (2006.01);
U.S. Cl.
CPC ...
G01N 25/72 (2013.01);
Abstract

Embodiments of the present invention provide methods and apparatus for analyzing thermal properties of bonding materials within a composite structure. One embodiment of the present invention provides an apparatus for analyzing thermal property of a bonding material within a structure. The apparatus comprises a structure support having a supporting surface configured to support the structure, a heat source configured to direct a heat flux to the structure supported by the supporting surface of the structure support, and a camera facing the structure supported on the structure support and configured to capture thermal images of the structure supported on the structure support.


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