The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2014

Filed:

Aug. 24, 2012
Applicants:

Masahiko Hata, Tsuchiura, JP;

Sadanori Yamanaka, Chiba, JP;

Tomoyuki Takada, Tsukuba, JP;

Kazuhiko Honjo, Ibaraki, JP;

Inventors:

Masahiko Hata, Tsuchiura, JP;

Sadanori Yamanaka, Chiba, JP;

Tomoyuki Takada, Tsukuba, JP;

Kazuhiko Honjo, Ibaraki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/737 (2006.01); H01L 23/31 (2006.01); H01L 27/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0605 (2013.01); H01L 2924/01023 (2013.01); H01L 23/3192 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/10336 (2013.01); H01L 2224/94 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01029 (2013.01); H01L 24/13 (2013.01); H01L 2224/05569 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01006 (2013.01); H01L 24/05 (2013.01); H01L 23/3121 (2013.01); H01L 23/3171 (2013.01); H01L 2924/10329 (2013.01); H01L 2224/13023 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01032 (2013.01); H01L 24/03 (2013.01); H01L 224/05571 (2013.01);
Abstract

Electronic device is provided, including: a base wafer whose surface is made of silicon crystal; a Group 3-5 compound semiconductor crystal formed directly or indirectly on partial region of the silicon crystal; an electronic element including a portion of the Group 3-5 compound semiconductor crystal as active layer; an insulating film formed directly or indirectly on the base wafer and covering the electronic element; an electrode formed directly or indirectly on the insulating film; a first coupling wiring extending through the insulating film, having at least a portion thereof formed directly or indirectly on the insulating film, and electrically coupling the electronic element with the electrode; a passive element formed directly or indirectly on the insulating film; a second coupling wiring extending through the insulating film, having at least a portion thereof formed directly or indirectly on the insulating film, and electrically coupling the electronic element with the passive element.


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