The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Oct. 24, 2011
Takashi Ito, Nagano, JP;
Tomoo Yamasaki, Nagano, JP;
Yuta Sakaguchi, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Abstract
A method of manufacturing a wiring substrate, includes forming a laminated body in which a nickel copper alloy layer is formed via an insulating resin layer, on a first wiring layer, forming a via hole reaching the first wiring layer in the nickel copper alloy layer and the insulating resin layer, applying a desmear process to an inside of the via hole, forming a seed layer on the nickel copper alloy layer and an inner surface of the via hole, forming a plating resist in which an opening portion is provided on a part containing the via hole, forming a metal plating layer in the opening portion in the plating resist by an electroplating, removing the plating resist, and forming a second wiring layer by etching the seed layer and the nickel copper alloy layer while using the metal plating layer as a mask.