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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8877884 B1

PDFFull Text
Date of Patent:
Nov. 04, 2014

Filed:

Jul. 07, 2009

Adhesive composition, film adhesive, and method for producing the adhesive composition

Applicants:

Motoki Takahashi, Kawasaki, JP;

Hirofumi Imai, Kawasaki, JP;

Takahiro Asai, Kawasaki, JP;

Koichi Misumi, Kawasaki, JP;

Toshiyuki Ogata, Kawasaki, JP;

Inventors:

Motoki Takahashi, Kawasaki, JP;

Hirofumi Imai, Kawasaki, JP;

Takahiro Asai, Kawasaki, JP;

Koichi Misumi, Kawasaki, JP;

Toshiyuki Ogata, Kawasaki, JP;

Assignee:

Tokyo Ohka Kogyo Co., Ltd., Kanagawa, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Richard A Huhn

Int. Cl.
CPC ...
C08F 212/08 (2006.01); C09J 7/02 (2006.01); C09J 125/04 (2006.01); C09J 133/04 (2006.01); C09J 135/00 (2006.01); C08F 6/10 (2006.01); C08F 6/12 (2006.01); C09J 125/14 (2006.01); C08F 220/12 (2006.01); C08J 3/09 (2006.01); C09J 133/24 (2006.01); C09J 125/08 (2006.01); C09J 135/06 (2006.01); C07B 63/00 (2006.01); C08F 6/00 (2006.01); C08F 220/14 (2006.01); C08F 220/18 (2006.01); C08F 222/40 (2006.01);
U.S. Cl.
CPC ...
C09J 7/02 (2013.01); C09J 125/04 (2013.01); C09J 133/04 (2013.01); C09J 135/00 (2013.01); C08J 2325/08 (2013.01); C08F 6/10 (2013.01); C08F 6/12 (2013.01); C08F 212/08 (2013.01); C08J 2325/14 (2013.01); C09J 125/14 (2013.01); C08F 220/12 (2013.01); C08J 3/095 (2013.01); C09J 133/24 (2013.01); C09J 125/08 (2013.01); C09J 135/06 (2013.01); C07B 63/00 (2013.01); C08F 6/001 (2013.01); C08F 220/14 (2013.01); C08F 2220/1825 (2013.01); C08F 2222/402 (2013.01);
Abstract

An adhesive composition is disclosed which includes a polymer prepared by copolymerizing a monomer containing a polymerizable group, the polymer including a low-molecular-weight component having a molecular weight equivalent to 1% or less of the weight-average molecular weight of the polymer, the low-molecular-weight component is contained in a range of not less than 0 weight % to less than 0.3 weight % of the total weight of the polymer. This allows provision of an adhesive composition having great adhesive strength in a high-temperature environment, especially at temperatures from 140° C. to 200° C., as well as high heat resistance and favorable crack resistance.

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