The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Dec. 14, 2012
Applicant:
Cree, Inc., Durham, NC (US);
Inventors:
Van Allen Mieczkowski, Apex, NC (US);
Daniel James Namishia, Louisburg, NC (US);
Assignee:
Cree, Inc., Durham, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/58 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 23/562 (2013.01); H01L 2924/3011 (2013.01); H01L 2221/68327 (2013.01); H01L 23/585 (2013.01); H01L 2924/0002 (2013.01); H01L 21/6836 (2013.01);
Abstract
An apparatus that comprises a device on a substrate and a crack stop in the substrate. Methods of forming a device are also disclosed. The methods may include providing a device, such as a semiconductor device, on a substrate having a first thickness, reducing the thickness of the substrate to a second thickness, and providing a crack stop in the substrate. Reducing the thickness of the substrate may include mounting the substrate to a carrier substrate for support and then removing the carrier substrate. The crack stop may prevent a crack from reaching the device.