The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2014
Filed:
Aug. 27, 2012
Applicants:
Su Jung Jung, Seoul, KR;
Byung Mok Kim, Seoul, KR;
Young Jun Cho, Seoul, KR;
Seo Yeon Kwon, Seoul, KR;
Inventors:
Su Jung Jung, Seoul, KR;
Byung Mok Kim, Seoul, KR;
Young Jun Cho, Seoul, KR;
Seo Yeon Kwon, Seoul, KR;
Assignee:
LG Innotek Co., Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48227 (2013.01); H01L 25/167 (2013.01); H01L 33/642 (2013.01); H01L 2224/48091 (2013.01);
Abstract
A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region.