The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2014
Filed:
Sep. 14, 2012
Shigenori Sawachi, Kawasaki, JP;
Osamu Yamagata, Kawasaki, JP;
Hiroshi Inoue, Kawasaki, JP;
Satoru Itakura, Kawasaki, JP;
Tomoshige Chikai, Kawasaki, JP;
Masahiko Hori, Kawasaki, JP;
Akio Katsumata, Kawasaki, JP;
Shigenori Sawachi, Kawasaki, JP;
Osamu Yamagata, Kawasaki, JP;
Hiroshi Inoue, Kawasaki, JP;
Satoru Itakura, Kawasaki, JP;
Tomoshige Chikai, Kawasaki, JP;
Masahiko Hori, Kawasaki, JP;
Akio Katsumata, Kawasaki, JP;
J-Devices Corporation, Usuki-Shi, Oita, JP;
Abstract
A semiconductor device containing: a semiconductor element; a support substrate; an insulating material layer for sealing the semiconductor element and a periphery thereof; a metal thin film wiring layer provided in the insulating material layer, with a part thereof being exposed on an external surface; and metal vias provided in the insulating material layer and electrically connected to the metal thin film wiring layer. The semiconductor element is provided in a plurality of units and the respective semiconductor elements are stacked via an insulating material such that a circuit surface of each semiconductor element faces the metal thin film wiring layer, and electrode pads of each semiconductor element are exposed without being hidden by the semiconductor element stacked thereabove.