The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8872248 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 28, 2014

Filed:

Feb. 22, 2013
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Yu-Hong Pan, Tainan, TW;

Jen-Pan Wang, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/76 (2006.01); H01L 29/94 (2006.01); H01L 31/119 (2006.01); H01L 27/04 (2006.01); H01L 21/82 (2006.01);
U.S. Cl.
CPC ...
H01L 27/04 (2013.01); H01L 21/82 (2013.01);
Abstract

An integrated circuit includes a semiconductor substrate, and an insulation region extending from a top surface of the semiconductor substrate into the semiconductor substrate. An Inter-Layer Dielectric (ILD) is overlying the insulation region. A capacitor includes a first capacitor plate including a first slot contact plug, and a second capacitor plate including a second slot contact plug. The first and the second contact plugs include portions in the ILD. A portion of the ILD between vertical surfaces of the first slot contact plug and the second slot contact plug acts as a capacitor insulator of the capacitor.


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