The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2014

Filed:

Jan. 10, 2014
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Kazuhiro Kaibara, Osaka, JP;

Yoshiharu Anda, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01); H01L 29/812 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 29/417 (2006.01); H01L 23/482 (2006.01); H01L 29/423 (2006.01); H01L 29/778 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 29/812 (2013.01); H01L 2924/0002 (2013.01); H01L 23/5226 (2013.01); H01L 29/7787 (2013.01); H01L 29/41758 (2013.01); H01L 23/4824 (2013.01); H01L 29/42356 (2013.01);
Abstract

A nitride semiconductor device includes: first electrode interconnect layers extending in parallel with one another over the nitride semiconductor layer and divided by areas extending across a longitudinal direction of the first electrode interconnect layers; first gate electrodes extending along the first electrode interconnect layers; first gate electrode connecting interconnects extending in associated ones of the areas dividing the first electrode interconnect layers and being in connection to the first gate electrodes; first electrode connecting interconnects formed above the first gate electrode connecting interconnects and being in connection to the first electrode interconnect layers; a first electrode upper interconnects formed on the first electrode connecting interconnects with an interconnect insulating film interposed therebetween, and being in connection to the first electrode connecting interconnects through associated ones of openings of the interconnect insulating film.


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