The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2014

Filed:

May. 16, 2013
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Shunsuke Yamada, Osaka, JP;

Hideto Tamaso, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 29/94 (2006.01); H01L 31/0312 (2006.01); H01L 29/16 (2006.01); H01L 21/3205 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 21/32053 (2013.01); Y10S 438/931 (2013.01);
Abstract

A silicon carbide semiconductor device includes a silicon carbide substrate and a contact electrode. The silicon carbide substrate includes an n type region and a p type region that makes contact with the n type region. The contact electrode makes contact with the n type region and the p type region. The contact electrode contains Ni atoms and Si atoms. The number of the Ni atoms is not less than 87% and not more than 92% of the total number of the Ni atoms and the Si atoms. Accordingly, there can be provided a silicon carbide semiconductor device, which can achieve ohmic contact with an n type impurity region and can achieve a low contact resistance for a p type impurity region, as well as a method for manufacturing such a silicon carbide semiconductor device.


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