The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Apr. 10, 2013
Applicant:
Vishay General Semiconductor Llc, Hauppauge, NY (US);
Inventors:
Assignee:
Vishay General Semiconductor LLC, Hauppauge, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/40 (2006.01); H01L 23/495 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 23/3107 (2013.01); H01L 23/4093 (2013.01); H01L 23/49586 (2013.01); H01L 23/3672 (2013.01); H01L 2224/32245 (2013.01);
Abstract
A semiconductor device mountable to a substrate is provided. The device includes a semiconductor package having at least one semiconductor die, an electrically conductive attachment region, and a packaging material in which is embedded the semiconductor die and a first portion of the electrically conductive attachment region contacting the die. A metallic shell encloses the embedded semiconductor die and the first portion of the electrically conductive attachment region.