The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2014

Filed:

Jul. 22, 2011
Applicants:

Jimin Zhang, San Jose, CA (US);

Zhihong Wang, Santa Clara, CA (US);

Harry Q. Lee, Los Altos, CA (US);

Wen-chiang Tu, Mountain View, CA (US);

Inventors:

Jimin Zhang, San Jose, CA (US);

Zhihong Wang, Santa Clara, CA (US);

Harry Q. Lee, Los Altos, CA (US);

Wen-Chiang Tu, Mountain View, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 21/00 (2006.01); G01J 3/00 (2006.01); B24B 37/04 (2012.01); H01L 21/66 (2006.01); B24B 37/013 (2012.01); G01B 11/06 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); G01B 11/0633 (2013.01); G01B 11/0683 (2013.01); H01L 21/3212 (2013.01); B24B 37/042 (2013.01); H01L 22/12 (2013.01); H01L 22/26 (2013.01);
Abstract

A method of polishing includes polishing a substrate having a second layer overlying a first layer, measuring a sequence of groups of spectra of light from the substrate while the substrate is being polished, each group of the groups of spectra including spectra from different locations on the substrate, for each group, calculating a value for a dispersion parameter of the spectra in the group to generate a sequence of dispersion values, and detecting exposure of the first layer based on the sequence of dispersion values.


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