The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2014

Filed:

Jun. 22, 2012
Applicant:

Yukiya Usui, Osaka, JP;

Inventor:

Yukiya Usui, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor substrate having dot marks is provided. Particularly, a semiconductor substrate having dot marks having an improved reading rate is provided. In a semiconductor substrate having a plurality of dot marks formed of recess portions having an inverted frustum shape, the plurality of dot marks constitutes a two-dimensional code disposed in a rectangular region of 0.25 mmto 9 mm, the diameter W of the recess portion on the surface of the semiconductor substrate is 20 μm to 200 μm, is larger than the diameter w of the bottom surface of the recess portion, and is smaller than the thickness of the semiconductor substrate, the side surface of the recess portion has four or more trapezoidal flat taper surfaces, and the taper angle of the taper surface is in a range of 44° to 65° with respect to the surface of the semiconductor substrate.


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