The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2014

Filed:

Nov. 26, 2007
Applicants:

Amitava Chatterjee, Plano, TX (US);

Howard Tigelaar, Allen, TX (US);

Victor Sutcliffe, Frisco, TX (US);

Inventors:

Amitava Chatterjee, Plano, TX (US);

Howard Tigelaar, Allen, TX (US);

Victor Sutcliffe, Frisco, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 27/118 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76816 (2013.01); H01L 23/53238 (2013.01); H01L 21/76895 (2013.01); H01L 21/76877 (2013.01); H01L 27/11807 (2013.01); H01L 23/53257 (2013.01); H01L 23/5226 (2013.01);
Abstract

One embodiment relates to an integrated circuit that includes at least one semiconductor device. The integrated circuit includes a first contact associated with a first terminal of the semiconductor device. The first contact spans a dielectric layer and couples the first terminal to an interconnect line that communicates signals horizontally on the integrated circuit, where the interconnect line has a first composition. The integrated circuit further includes a second contact associated with a second terminal of the semiconductor device. The second contact spans the dielectric layer and couples the second terminal to a landing pad to which a via is coupled, where the landing pad has a second composition that differs from the first composition. Other circuits and methods are also disclosed.


Find Patent Forward Citations

Loading…