The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2014

Filed:

Apr. 12, 2012
Applicants:

Hsiang-lan Lung, Ardsley, NY (US);

Chung Hon Lam, Peekskill, NY (US);

Matthew J. Breitwisch, Pound Ridge, NY (US);

Inventors:

Hsiang-Lan Lung, Ardsley, NY (US);

Chung Hon Lam, Peekskill, NY (US);

Matthew J. Breitwisch, Pound Ridge, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 27/24 (2006.01); H01L 45/00 (2006.01);
U.S. Cl.
CPC ...
H01L 45/144 (2013.01); H01L 27/2436 (2013.01); H01L 45/1233 (2013.01); H01L 45/1641 (2013.01); H01L 45/1675 (2013.01); H01L 45/1625 (2013.01); H01L 27/2472 (2013.01); H01L 45/1253 (2013.01); H01L 45/06 (2013.01);
Abstract

An array of phase change memory cells is manufactured by forming a separation layer over an array of contacts, forming a patterning layer on the separation layer and forming an array of mask openings in the patterning layer using lithographic process. Etch masks are formed within the mask openings by a process that compensates for variation in the size of the mask openings that result from the lithographic process. The etch masks are used to etch through the separation layer to define an array of electrode openings exposing the underlying contacts. Electrode material is deposited within the electrode openings; and memory elements are formed over the bottom electrodes. Finally, bit lines are formed over the memory elements to complete the memory cells. In the resulting memory array, the critical dimension of the top surface of bottom electrode varies less than the width of the memory elements in the mask openings.


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