The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Feb. 26, 2013
Chin-sheng Wang, Hsinchu County, TW;
Chien-ming Chen, Hsinchu County, TW;
Chin-Sheng Wang, Hsinchu County, TW;
Chien-Ming Chen, Hsinchu County, TW;
Subtron Technology Co., Ltd., Hsinchu County, TW;
Abstract
A package carrier includes a substrate, first and second insulation layers, first and second patterned circuit layers, at least one first and second conductive through holes, a heat dissipation channel, an adhesive layer and a heat conducting element. The first and second patterned circuit layers are respectively disposed on the first and second insulation layers which are respectively disposed on upper and lower surfaces of the substrate. The heat dissipation channel at least passes through the first insulation layer, the first and second patterned circuit layers, and the substrate. The first and second conductive through holes electrically connect with the substrate, the first and second patterned circuit layers. At least two opposite side surfaces of the heat conducting element each includes at least one convex portion or at least one concave portion. The heat conducting element is mounted in the heat dissipation channel via the adhesive layer.