The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2014

Filed:

Aug. 27, 2012
Applicants:

Daniel Goodman, Lexington, MA (US);

Arthur Keigler, Wellesley, MA (US);

Terry Mcelroy, Arlington, MA (US);

Gary Boulet, Rindge, NH (US);

Inventors:

Daniel Goodman, Lexington, MA (US);

Arthur Keigler, Wellesley, MA (US);

Terry McElroy, Arlington, MA (US);

Gary Boulet, Rindge, NH (US);

Assignee:

Tel Nexx, Inc., Billerica, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); H01L 21/67 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
B44C 1/22 (2013.01); H01L 21/6719 (2013.01); H01L 21/02087 (2013.01); H01L 21/6708 (2013.01); Y10S 134/902 (2013.01);
Abstract

A substrate edge bevel etch module for etching a material from a peripheral edge of a substrate with an etchant is described. The substrate edge bevel etch module includes a rotatable substrate holder having a support for a substrate, and a surface tension etch applicator comprising a wetted etching surface opposing a substrate surface proximate an edge of the substrate when the surface tension etch applicator is located proximate to the edge of the substrate. The surface tension etch applicator further includes an etchant dispensing portion, proximate the wetted etching surface, which dispenses an etchant in a region between the wetted etching surface and the substrate surface and wet at least a portion of the wetted etching surface and the substrate surface. A spacing between the wetted etching surface and the substrate surface is selected to retain the etchant using surface tension forces and form a meniscus there between.


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