The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Feb. 28, 2012
Applicant:
Craig J. Rotay, Audubon, PA (US);
Inventor:
Craig J. Rotay, Audubon, PA (US);
Assignee:
STMicroelectronics, Inc., Coppell, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 23/32 (2006.01); H01L 25/11 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 25/115 (2013.01); H01L 23/32 (2013.01); H01L 2924/09701 (2013.01); H01L 2223/6644 (2013.01); H01L 2924/0002 (2013.01); H01L 23/66 (2013.01); H01L 23/562 (2013.01);
Abstract
A semiconductor subassembly, a modular sidewall element having modular dimensions that accommodates placement of the semiconductor subassembly in a modular layout and a semiconductor substrate base element coupled to the modular sidewall element. The semiconductor substrate base element has at least one semiconductor element with a layout sized to be accommodated by modular dimensions of the modular sidewall element and the semiconductor substrate base element configured to form a base of the semiconductor subassembly.