The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Jan. 30, 2009
Shinya Morita, Toyama, JP;
Akihiro Sato, Toyama, JP;
Akinori Tanaka, Toyama, JP;
Shigeo Nakada, Toyama, JP;
Takayuki Nakada, Toyama, JP;
Shuhei Saido, Toyama, JP;
Tomoyuki Matsuda, Toyama, JP;
Shinya Morita, Toyama, JP;
Akihiro Sato, Toyama, JP;
Akinori Tanaka, Toyama, JP;
Shigeo Nakada, Toyama, JP;
Takayuki Nakada, Toyama, JP;
Shuhei Saido, Toyama, JP;
Tomoyuki Matsuda, Toyama, JP;
Hitachi Kokusai Electric, Inc., Tokyo, JP;
Abstract
Provided is a substrate processing apparatus. The substrate processing apparatus includes a reaction tube; a heating device configured to heat the reaction tube; and a manifold installed outward as compared with the heating device and made of a non-metallic material. A first thickness of the manifold defined in a direction perpendicular to a center axis of the reaction tube is greater than a second thickness of the manifold defined at a position adjacent to the reaction tube in a direction parallel to the center axis of the reaction tube. The manifold includes a protrusion part of which at least a portion protrudes inward more than an inner wall of the reaction tube, and a gas supply unit disposed at at least the protrusion part for supplying gas to an inside of the reaction tube.