The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Mar. 31, 2009
Applicants:

Martin Liu, Yonghe, TW;

Chung-yi Yu, Hsin-Chu, TW;

Che Ying Hsu, Tianjhong Township, Changhua County, TW;

Yeur-luen Tu, Taichung, TW;

Da-hsiang Chou, Tainan, TW;

Chia-shiung Tsai, Hsin Chu, TW;

Inventors:

Martin Liu, Yonghe, TW;

Chung-Yi Yu, Hsin-Chu, TW;

Che Ying Hsu, Tianjhong Township, Changhua County, TW;

Yeur-Luen Tu, Taichung, TW;

Da-Hsiang Chou, Tainan, TW;

Chia-Shiung Tsai, Hsin Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/50 (2006.01); C23C 16/00 (2006.01); C23F 1/00 (2006.01); H01L 21/306 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01);
Abstract

Provided is an apparatus and a method of holding a device. The apparatus includes a wafer chuck having first and second holes that extend therethrough, and a pressure control structure that can independently and selectively vary a fluid pressure in each of the first and second holes between pressures above and below an ambient pressure. The method includes providing a wafer chuck having first and second holes that extend therethrough, and independently and selectively varying a fluid pressure in each of the first and second holes between pressures above and below an ambient pressure.


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