The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2014

Filed:

Dec. 29, 2011
Applicants:

Sung-hwan Cha, Uiwang-si, KR;

Sang-ran Koh, Uiwang-si, KR;

Yong Kook Kim, Uiwang-si, KR;

Woo-han Kim, Uiwang-si, KR;

Ha Neul Kim, Uiwang-si, KR;

Chi Won an, Uiwang-si, KR;

Inventors:

Sung-Hwan Cha, Uiwang-si, KR;

Sang-Ran Koh, Uiwang-si, KR;

Yong Kook Kim, Uiwang-si, KR;

Woo-Han Kim, Uiwang-si, KR;

Ha Neul Kim, Uiwang-si, KR;

Chi Won An, Uiwang-si, KR;

Assignee:

Cheil Industries, Inc., Gumi-si, Kyeongsangbuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); C08L 83/05 (2006.01);
U.S. Cl.
CPC ...
Abstract

A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si—Vi) at its terminal end, wherein a ratio (Si—H/Si—Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si—Vi) in the second polysiloxane is about 1 to about 1.


Find Patent Forward Citations

Cha, Sung-Hwan. (2014). Resin for transparent encapsulation material, and associated encapsulation material and electronic device (U.S. Patent No. 8847414). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8847414

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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