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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8847395 B1

PDFFull Text
Expired
Date of Patent:
Sep. 30, 2014

Filed:

Jul. 05, 2011

Microelectronic device having metal interconnection levels connected by programmable vias

Applicants:

Thomas Ernst, Morette, FR;

Paul-henry Morel, Corenc, FR;

Sylvain Maitrejean, Grenoble, FR;

Inventors:

Thomas Ernst, Morette, FR;

Paul-Henry Morel, Corenc, FR;

Sylvain Maitrejean, Grenoble, FR;

Assignee:

Commissariat à l'énergie atomique et aux énergies alternatives, Paris, FR;

Attorney:

Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Telly Green

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 21/768 (2006.01); H01L 21/822 (2006.01); H01L 29/423 (2006.01); H01L 21/02 (2006.01); H01L 21/8234 (2006.01); H01L 29/786 (2006.01); H01L 29/66 (2006.01); H01L 23/522 (2006.01); H01L 29/06 (2006.01); H01L 29/775 (2006.01); H01L 23/525 (2006.01); H01L 27/105 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76879 (2013.01); H01L 21/8221 (2013.01); H01L 29/42392 (2013.01); H01L 21/02532 (2013.01); H01L 21/823487 (2013.01); H01L 2221/1094 (2013.01); H01L 21/02653 (2013.01); H01L 21/02603 (2013.01); H01L 29/78642 (2013.01); H01L 21/02425 (2013.01); H01L 29/66439 (2013.01); H01L 21/02639 (2013.01); H01L 23/5226 (2013.01); H01L 29/66666 (2013.01); H01L 29/0676 (2013.01); H01L 29/775 (2013.01); H01L 27/105 (2013.01); H01L 21/76802 (2013.01); H01L 29/0665 (2013.01); H01L 40/00 (2013.01); H01L 10/00 (2013.01); H01L 21/0262 (2013.01); H01L 23/525 (2013.01);
Abstract

A microelectronic device, including: a substrate and a plurality of metal interconnection levels stacked on the substrate; a first metal line of a given metal interconnection level; a second metal line of another metal interconnection level located above the given metal interconnection level, the first and second lines are interconnected via at least one semiconductor connection element extending in a direction forming a nonzero angle with the first metal lines and the second metal line; and a gate electrode capable of controlling conduction of the semiconductor connection element.

Find Patent Forward Citations

Ernst, Thomas. (2014). Microelectronic device having metal interconnection levels connected by programmable vias (U.S. Patent No. 8847395). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8847395

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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