The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Sep. 27, 2013
Applicant:
Ibiden Co., Ltd., Ogaki, JP;
Inventors:
Assignee:
Ibiden Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0274 (2013.01); H05K 3/46 (2013.01);
Abstract
A printed wiring board includes an outermost interlayer resin insulation layer, n outermost conductive layer formed on the outermost interlayer resin insulation layer and including multiple alignment marks, a connection wiring structure connecting the alignment marks, and a solder-resist layer formed on the outermost interlayer resin insulation layer and the outermost conductive layer. The solder-resist layer has openings exposing the alignment marks, respectively, and each of the alignment marks has an electroless plated film formed on each of the alignment marks.