The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Oct. 07, 2011
Yunfei LI, Fremont, CA (US);
GE Yi, San Ramon, CA (US);
Dujiang Wan, Fremont, CA (US);
Guanghong Luo, Fremont, CA (US);
Lijie Zhao, Pleasanton, CA (US);
Yanfeng Chen, Milpitas, CA (US);
Lily Yao, Hayward, CA (US);
Ming Jiang, San Jose, CA (US);
Yunfei Li, Fremont, CA (US);
Ge Yi, San Ramon, CA (US);
Dujiang Wan, Fremont, CA (US);
Guanghong Luo, Fremont, CA (US);
Lijie Zhao, Pleasanton, CA (US);
Yanfeng Chen, Milpitas, CA (US);
Lily Yao, Hayward, CA (US);
Ming Jiang, San Jose, CA (US);
Western Digital (Fremont), LLC, Fremont, CA (US);
Abstract
Embodiments of the present invention relate to reducing the size variation on a wafer fabrication. In some embodiments, at least a portion the backfill material over features larger than a threshold size is etched or milled to provide backfill protrusions over those features. The backfill protrusions are configured to reduce the size variation across the fabrication. Embodiments of the invention may be used in fabrication of many types of devices, such as tapered wave guides (TWG), near-field transducers (NFT), MEMS devices, EAMR optical devices, optical structures, bio-optical devices, micro-fluidic devices, and magnetic writers.