The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Feb. 21, 2006
Yuh-hwa Chang, Shulin, TW;
Ming-tai Chung, Hsinchu, TW;
Jui-chun Weng, Taipei, TW;
Ming-yi Lin, Hsinchu, TW;
Yuh-Hwa Chang, Shulin, TW;
Ming-Tai Chung, Hsinchu, TW;
Jui-Chun Weng, Taipei, TW;
Ming-Yi Lin, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A method and structure for preventing film delamination provide for forming a thick film then partitioning the thick film into a plurality of discrete portions prior to subsequent thermal processing operations. The partitioning alleviates the effects of film stress at the interface between the film and the underlying material and prevents delamination during the subsequent thermal cycling operations, that take place subsequent to the formation of the film. The partitioned film includes a pattern density of at least about 80 percent and the discrete portions do not individually serve as device structures.