The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Mar. 12, 2012
Michael John Ries, St. Charles, MO (US);
Jeffrey L. Libbert, O'Fallon, MO (US);
Dale A. Witte, O'Fallon, MO (US);
Michael John Ries, St. Charles, MO (US);
Jeffrey L. Libbert, O'Fallon, MO (US);
Dale A. Witte, O'Fallon, MO (US);
SunEdison Semiconductor Limited (UEN201334164H), Singapore, SG;
Abstract
Systems and methods are provided for mechanically cleaving a bonded wafer pair by controlling the rate of cleaving. This controlled rate of cleaving results in a reduction or elimination of non-uniform thickness variations in the cleaved surface of the resulting SOI wafer. One embodiment uses flexible chucks attached to the faces of the wafers and actuators attached to the flexible chucks to cleave the bonded wafer pair. Other embodiments also use rollers in contact with the surfaces to control the rate of cleaving.