The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Nov. 27, 2003
Masahiko Nakamori, Ohtsu, JP;
Tetsuo Shimomura, Ohtsu, JP;
Takatoshi Yamada, Ohtsu, JP;
Kazuyuki Ogawa, Osaka, JP;
Atsushi Kazuno, Osaka, JP;
Masahiro Watanabe, Osaka, JP;
Masahiko Nakamori, Ohtsu, JP;
Tetsuo Shimomura, Ohtsu, JP;
Takatoshi Yamada, Ohtsu, JP;
Kazuyuki Ogawa, Osaka, JP;
Atsushi Kazuno, Osaka, JP;
Masahiro Watanabe, Osaka, JP;
Toyo Tire & Rubber Co., Ltd., Osaka-shi, JP;
Abstract
A polishing pad enabling a highly precise optical endpoint sensing during the polishing process and thus having excellent polishing characteristics (such as surface uniformity and in-plane uniformity) is disclosed. A polishing pad enabling to obtain the polishing profile of a large area of a wafer is also disclosed. A polishing pad of a first invention comprises a light-transmitting region having a transmittance of not less than 50% over the wavelength range of 400 to 700 nm. A polishing pad of a second invention comprises a light-transmitting region having a thickness of 0.5 to 4 mm and a transmittance of not less than 80% over the wavelength range of 600 to 700 nm. A polishing pad of a third invention comprises a light-transmitting region arranged between the central portion and the peripheral portion of the polishing pad and having a length (D) in the diametrical direction which is three times or more longer than the length (L) in the circumferential direction.