The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2014

Filed:

Sep. 09, 2009
Applicants:

Steve Poppe, Pleasanton, CA (US);

Yan Rozenzon, San Carlos, CA (US);

David Z. Chen, San Jose, CA (US);

Xiaole Yan, Santa Clara, CA (US);

Peijun Ding, Saratoga, CA (US);

Zheng Xu, Pleasanton, CA (US);

Inventors:

Steve Poppe, Pleasanton, CA (US);

Yan Rozenzon, San Carlos, CA (US);

David Z. Chen, San Jose, CA (US);

Xiaole Yan, Santa Clara, CA (US);

Peijun Ding, Saratoga, CA (US);

Zheng Xu, Pleasanton, CA (US);

Assignee:

Silevo, Inc., Fremont, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01); C30B 25/16 (2006.01); C23C 16/455 (2006.01); C23C 16/48 (2006.01); C30B 25/12 (2006.01); C30B 25/14 (2006.01); C23C 16/44 (2006.01); C30B 25/10 (2006.01); C23C 16/458 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4408 (2013.01); C30B 25/165 (2013.01); C23C 16/455 (2013.01); C23C 16/481 (2013.01); C30B 25/12 (2013.01); C30B 25/14 (2013.01); C30B 25/105 (2013.01); C23C 16/4587 (2013.01);
Abstract

One embodiment provides an apparatus for material deposition. The apparatus includes a reaction chamber, and a pair of susceptors. Each susceptor has a front side mounting substrates and a back side. The front sides of the vertically positioned susceptors face each other, and the vertical edges of the susceptors are in contact with each other. The apparatus also includes a number of gas nozzles for injecting reaction gases. The gas flow directions inside the chamber can be alternated by controlling the gas nozzles. The gas nozzles are configured to inject a small amount of purge gas including at least one of: HCl, SiCl, and Hwhen the gas nozzles are not injecting reaction gas. The apparatus includes a number of heating units situated outside the reaction chamber. The heating units are arranged in such a way that they radiate heat energy directly to the back sides of the susceptors.


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