The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2014

Filed:

Apr. 18, 2007
Applicants:

Nobuhito Suehira, Kawasaki, JP;

Junichi Seki, Yokohama, JP;

Hideki Ina, Tokyo, JP;

Koichi Sentoku, Tochigi-ken, JP;

Inventors:

Nobuhito Suehira, Kawasaki, JP;

Junichi Seki, Yokohama, JP;

Hideki Ina, Tokyo, JP;

Koichi Sentoku, Tochigi-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/00 (2006.01); B29C 43/58 (2006.01); B82Y 10/00 (2011.01); G03F 9/00 (2006.01); B82Y 40/00 (2011.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B82Y 10/00 (2013.01); G03F 9/00 (2013.01); B82Y 40/00 (2013.01); G03F 9/703 (2013.01); G03F 9/7049 (2013.01); G03F 9/7088 (2013.01);
Abstract

An imprint apparatus for performing alignment between a mold and a substrate and imprinting a pattern of the mold to a layer of the substrate. A holder holds the mold. A stage holds the substrate opposite to the mold held by the holder. A microscope, including an image pickup device, detects a first alignment mark formed in the mold, via a first image pickup area of the image pickup device, and detects a second alignment mark formed in the substrate, via a second image pickup area of the image pickup device. The first and second image pickup areas do not overlap with each other. A contrast of signals obtained by the image pickup device is adjusted with respect to each of the first and second image pickup areas, and the alignment is performed by changing relative positions of the holder and the stage based on first information about a deviation of the detected first alignment mark from a predetermined position in the first image pickup area and second information about a deviation of the detected second alignment mark from a predetermined position in the second image pickup area.


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