The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2014
Filed:
Jun. 24, 2013
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
Paul A. Farrar, Bluffton, SC (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/82 (2006.01); H01L 23/473 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/82 (2013.01); H01L 23/473 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06513 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2924/0002 (2013.01); H01L 2225/06589 (2013.01);
Abstract
Methods and devices for multi-chip stacks are shown. A method is shown that assembles multiple chips into stacks by stacking wafers prior to dicing into individual chips. Methods shown provide removal of defective chips and their replacement during the assembly process to improve manufacturing yield.
Farrar, Paul. (2014). High density chip packages, methods of forming, and systems including same (U.S. Patent No. 8841169). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8841169
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile