The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2014
Filed:
Aug. 02, 2012
Applicants:
Tsuyoshi Yokoyama, Tokyo, JP;
Kazunori Inoue, Tokyo, JP;
Kazuhiro Matsumoto, Tokyo, JP;
Inventors:
Assignee:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 31/00 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
H03H 9/1092 (2013.01); H03H 9/059 (2013.01); H03H 9/1085 (2013.01);
Abstract
A production method of an electronic component includes: forming a sheet having a resin layer and a metal layer formed under the resin layer; bonding the sheet to a substrate so that the metal layer is arranged on a functional portion of an acoustic wave element formed on the substrate, a frame portion surrounding the functional portion is formed between the metal layer and the substrate, a cavity is formed on the functional portion by the metal layer and the frame portion, and the resin layer covers the metal layer and the frame portion.