The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2014
Filed:
Jun. 06, 2013
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Yeun-Sang Park, Yongin-si, KR;
Byung-Lyul Park, Seoul, KR;
SungHee Kang, Seongnam-si, KR;
Taeseong Kim, Suwon-si, KR;
Kwangjin Moon, Hwaseong-si, KR;
Sukchul Bang, Yongin-si, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/528 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73257 (2013.01); H01L 2924/15311 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16145 (2013.01);
Abstract
Semiconductor devices are disclosed. The semiconductor device may include a semiconductor substrate having a first surface and a second surface opposite to each other and a pad trench formed at a portion of the second surface, a through-electrode penetrating the semiconductor substrate and protruding from a bottom surface of the pad trench. A buried pad may be disposed in the pad trench and may surround the through-electrode.