The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2014
Filed:
Mar. 08, 2012
Griselda Bonilla, Fishkill, NY (US);
Kaushik Chanda, Santa Clara, CA (US);
Samuel Sung Shik Choi, Beacon, NY (US);
Ronald G. Filippi, Wappingers Fall, NY (US);
Stephan Grunow, Poughkeepsie, NY (US);
Naftali Eliahu Lustig, Croton on Hudson, NY (US);
Andrew H. Simon, Fishkill, NY (US);
Griselda Bonilla, Fishkill, NY (US);
Kaushik Chanda, Santa Clara, CA (US);
Samuel Sung Shik Choi, Beacon, NY (US);
Ronald G. Filippi, Wappingers Fall, NY (US);
Stephan Grunow, Poughkeepsie, NY (US);
Naftali Eliahu Lustig, Croton on Hudson, NY (US);
Andrew H. Simon, Fishkill, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A fuse structure includes within an aperture within a dielectric layer located over a substrate that exposes a conductor contact layer within the substrate a seed layer interposed between the conductor contact layer and another conductor layer. The seed layer includes a doped copper material that includes a dopant immobilized predominantly within the seed layer. The fuse structure may be severed while not severing a conductor interconnect structure also located over the substrate that exposes a second conductor contact layer within a second aperture. In contrast with the fuse structure that includes the doped seed layer having the immobilized dopant, the interconnect structure includes a doped seed layer having a mobile dopant.