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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8835773 B1

PDFFull Text
Date of Patent:
Sep. 16, 2014

Filed:

Apr. 01, 2010

Wiring board and method of manufacturing the same

Applicants:

Shigetsugu Muramatsu, Nagano, JP;

Yasuhiko Kusama, Nagano, JP;

Inventors:

Shigetsugu Muramatsu, Nagano, JP;

Yasuhiko Kusama, Nagano, JP;

Assignee:

Shinko Electric Industries Co., Ltd., Nagano-shi, JP;

Attorney:

Kratz, Quintos & Hanson, LLP

Primary Examiner:

Jayprakash N Gandhi

Assistant Examiner:

Dion R Ferguson

Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 7/00 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H05K 3/00 (2006.01); H01L 23/31 (2006.01); H05K 3/30 (2006.01); H05K 1/11 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3452 (2013.01); H05K 2203/025 (2013.01); H01L 23/49827 (2013.01); H01L 2924/01078 (2013.01); H01L 21/563 (2013.01); H05K 3/305 (2013.01); H05K 2201/0191 (2013.01); H01L 2924/01019 (2013.01); H01L 2224/73203 (2013.01); H05K 3/0044 (2013.01); H05K 2201/09045 (2013.01); H01L 2224/32225 (2013.01); H05K 2201/10977 (2013.01); H01L 2224/16225 (2013.01); H05K 2201/09881 (2013.01); H01L 23/3121 (2013.01); H05K 2201/09736 (2013.01); H05K 1/111 (2013.01); H05K 2201/10674 (2013.01); H05K 3/243 (2013.01); H05K 2201/09036 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/73204 (2013.01);
Abstract

A method of manufacturing a wiring board for use in mounting of an electronic component includes: forming an outermost wiring layer on a surface side where the electronic component is mounted; forming an insulating layer so as to cover the wiring layer; and forming a concave portion in the insulating layer. The concave portion is formed by removing, using a mask formed in a required shape by patterning, an exposed portion of the insulating layer in a step-like shape until a surface of a pad defined at a portion of the wiring layer is exposed. The concave portion is preferably formed by removing the portion of the insulating layer by sand blast.

Find Patent Forward Citations

Muramatsu, Shigetsugu. (2014). Wiring board and method of manufacturing the same (U.S. Patent No. 8835773). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8835773

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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