The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2014

Filed:

Dec. 12, 2011
Applicants:

Zhang Haiyang, Beijing, CN;

Minda HU, Beijing, CN;

Inventors:

Zhang Haiyang, Beijing, CN;

Minda Hu, Beijing, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/3205 (2006.01); H01L 21/027 (2006.01); H01L 21/033 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0276 (2013.01); H01L 21/32051 (2013.01); H01L 21/0337 (2013.01); H01L 21/31144 (2013.01);
Abstract

The present invention discloses a method of manufacturing a semiconductor device. In order to form a trench with a smaller width, patterns of various monomers are formed by utilizing self-assembly characteristics of a block copolymer comprising various monomers. A metal or metal nitride is deposited on a surface of the block copolymer, the metal or metallic nitride selectively depositing due to a preferential chemical affinity between various monomers and the metal or metal nitride. After reaching a certain thickness, the metal or metal nitride layer begins to grow laterally. Deposition can be stopped by controlling deposition time so that the metal or metal nitride layer grows laterally but does not completely cover the surface of the block copolymer. Etching is then conducted using the metal or metal nitride layer as a mask to obtain a trench with a very small width.


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