The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Jul. 29, 2013
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
Paul A. Silvestri, Meridian, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 21/50 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/48 (2013.01); H01L 2924/3011 (2013.01); H01L 25/18 (2013.01); H01L 2924/01076 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/014 (2013.01); H01L 23/50 (2013.01); H01L 21/50 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01005 (2013.01); H01L 2225/0651 (2013.01); H01L 2924/01006 (2013.01); H01L 24/49 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06506 (2013.01); H01L 2224/48145 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/14 (2013.01); H01L 25/0657 (2013.01); H01L 2224/49113 (2013.01);
Abstract
High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed.