The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2014

Filed:

Nov. 20, 2013
Applicant:

Microsemi Semiconductor Limited, Newport, GB;

Inventors:

Piers Tremlett, Coleford, GB;

Michael Anthony Higgins, Caldicot, GB;

Martin McHugh, Chepstow, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/06 (2006.01); H01L 25/16 (2006.01); H01L 23/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/16145 (2013.01); H01L 2924/01029 (2013.01); H01L 23/481 (2013.01); H01L 25/0657 (2013.01); H01L 24/14 (2013.01); H01L 24/82 (2013.01); H01L 24/81 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06513 (2013.01); H01L 25/16 (2013.01); H01L 2224/94 (2013.01); H01L 2224/02372 (2013.01); H01L 23/16 (2013.01); H01L 24/94 (2013.01); H01L 2224/06181 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06527 (2013.01); H01L 23/06 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/14181 (2013.01);
Abstract

An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive backside. Conductive pathways extend between the front and back sides of the integrated circuit. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive pathways and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side.


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