The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2014

Filed:

Nov. 30, 2011
Applicants:

Yukinobu Mikado, Ogaki, JP;

Shunsuke Sakai, Ogaki, JP;

Mitsuhiro Tomikawa, Ogaki, JP;

Inventors:

Yukinobu Mikado, Ogaki, JP;

Shunsuke Sakai, Ogaki, JP;

Mitsuhiro Tomikawa, Ogaki, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 3/00 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H05K 2203/1572 (2013.01); H05K 2203/1476 (2013.01); H05K 3/427 (2013.01); H05K 3/0038 (2013.01); H05K 2201/09536 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/09854 (2013.01); H05K 3/4602 (2013.01);
Abstract

A wiring board includes a core substrate having an opening portion and a through hole adjacent to the opening portion, a capacitor positioned in the opening portion, and a through-hole conductor formed in the through hole of the core substrate and having a conductor filling the through hole. The core substrate has a first surface and a second surface on the opposite side of the first surface, the opening portion of the core substrate penetrates from the first surface to the second surface, the through-hole conductor has a first conductive portion and a second conductive portion connected to the first conductive portion in the core substrate, the first conductive portion of the through-hole conductor becomes narrower from the first surface toward the second surface, and the second conductive portion of the through-hole conductor becomes narrower from the second surface toward the first surface.


Find Patent Forward Citations

Loading…