The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Jan. 12, 2009
Mutsuyuki Kawaguchi, Amagasaki, JP;
Satoshi Saito, Amagasaki, JP;
Tsuyoshi Amatani, Amagasaki, JP;
Yuko Fujii, Amagasaki, JP;
Mutsuyuki Kawaguchi, Amagasaki, JP;
Satoshi Saito, Amagasaki, JP;
Tsuyoshi Amatani, Amagasaki, JP;
Yuko Fujii, Amagasaki, JP;
Mec Company Ltd., Amagasaki-Shi, JP;
Abstract
The object of the present invention is to provide an electroconductive layer that retains bondability to a resin layer certainly and is further a layer from which a copper-tin alloy layer is easily removed in a subsequent step, a laminate using this layer, and producing processes thereof. The electroconductive layer of the present invention is an electroconductive layer which is to be bonded to a resin layer, and which contains a copper layer and a copper-tin alloy layer laminated over the copper layer, wherein the copper-tin alloy layer has a thickness of 0.001 to 0.020 μm.