The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Jan. 13, 2012
Soichi Kumon, Matsusaka, JP;
Takashi Saio, Suzuka, JP;
Shinobu Arata, Matsusaka, JP;
Masanori Saito, Matsusaka, JP;
Hidehisa Nanai, Toshima-ku, JP;
Yoshinori Akamatsu, Matsusaka, JP;
Soichi Kumon, Matsusaka, JP;
Takashi Saio, Suzuka, JP;
Shinobu Arata, Matsusaka, JP;
Masanori Saito, Matsusaka, JP;
Hidehisa Nanai, Toshima-ku, JP;
Yoshinori Akamatsu, Matsusaka, JP;
Central Grass Company, Limited, Ube-shi, JP;
Abstract
A process for cleaning a wafer having an uneven pattern at its surface. The process includes at least the steps of: cleaning the wafer with a cleaning liquid; substituting the cleaning liquid retained in recessed portions of the wafer with a water-repellent liquid chemical after cleaning; and drying the wafer, wherein the cleaning liquid contains 80 mass % or greater of a solvent having a boiling point of 55 to 200° C., and wherein the water-repellent liquid chemical supplied in the substitution step has a temperature of not lower than 40° C. and lower than a boiling point of the water-repellent liquid chemical thereby imparting water repellency at least to surfaces of the recessed portions.