The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Oct. 08, 2008
Chih-chao Yang, Glenmont, NY (US);
Lynne M. Gignac, Beacon, NY (US);
Chao-kun HU, Somers, NY (US);
Surbhi Mittal, West Orange, NJ (US);
Chih-Chao Yang, Glenmont, NY (US);
Lynne M. Gignac, Beacon, NY (US);
Chao-Kun Hu, Somers, NY (US);
Surbhi Mittal, West Orange, NJ (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An interconnect structure including a noble metal-containing cap that is present at least on some portion of an upper surface of at least one conductive material that is embedded within an interconnect dielectric material is provided. In one embodiment, the noble metal-containing cap is discontinuous, e.g., exists as nuclei or islands on the surface of the at least one conductive material. In another embodiment, the noble metal-containing cap has a non-uniform thickness across the surface of the at least one conductive material.