The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Jul. 12, 2011
Gi Jeong Kim, Guri-si, KR;
Wan Jong Kim, Goyang-si, KR;
Gi Jeong Kim, Guri-si, KR;
Wan Jong Kim, Goyang-si, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
In one embodiment, a semiconductor package (e.g., a QFP package) includes a leadframe sized and configured to increase the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package includes a generally planar die pad defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads include exposed bottom surface portions that are provided in at least one row or ring, which at least partially circumvents the die pad, with other leads including portions that protrude from respective side surfaces of a package body of the semiconductor package. At least one semiconductor die is connected to the top surface of the die pad and is electrically connected to at least some of the leads. At least portions of the die pad, the leads, and the semiconductor die are encapsulated by a package body, with at least portions of the bottom surfaces of the die pad and some of the leads being exposed in a common exterior surface of the package body.