The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Nov. 30, 2011
Yogo Kawasaki, Ogaki, JP;
Hiroaki Satake, Ogaki, JP;
Yutaka Iwata, Ogaki, JP;
Tetsuya Tanabe, Ogaki, JP;
Yogo Kawasaki, Ogaki, JP;
Hiroaki Satake, Ogaki, JP;
Yutaka Iwata, Ogaki, JP;
Tetsuya Tanabe, Ogaki, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A multi-layer printed circuit board including a core substrate, lower interlayer resin insulating layers formed on the surfaces of the core substrate, respectively, through-hole conductors formed in penetrating holes penetrating through the core substrate and the lower interlayer resin insulating layers, conductor circuits formed on the lower interlayer resin insulating layers, respectively, upper interlayer resin insulating layers formed on the conductor circuits and the lower interlayer resin insulating layers, respectively and via hole conductors formed in the upper interlayer resin insulating layers and positioned on the through-hole conductors, respectively.