The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Oct. 02, 2006
Masanobu Tsujimoto, Hirakata, JP;
Isamu Yanada, Hirataka, JP;
Katsuaki Suganuma, Suita, JP;
Keunsoo Kim, Suita, JP;
Masanobu Tsujimoto, Hirakata, JP;
Isamu Yanada, Hirataka, JP;
Katsuaki Suganuma, Suita, JP;
Keunsoo Kim, Suita, JP;
C. Uyemura & Co., Ltd., Osaka, JP;
Osaka University, Osaka, JP;
Abstract
A surface treatment method of cladding a Sn or Sn alloy coating with one or more metals selected from among Mn, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, In, Ti, Ge, Pb, Sb and Bi continuously or discontinuously in such a way as to make the Sn or Sn alloy coating partially exposed, which method makes it possible to inhibit the generation of whiskers in an Sn or Sn alloy coating formed on the surface of a substrate to which other member is pressure-welded or the joint surface to be soldered. Cladding an Sn or Sn alloy coating with a prescribed metal continuously or discontinuously in such a way as to make the coating partially exposed inhibits the generation of whiskers by contact pressure in pressure welding, and further inhibits the generation of whiskers without impairing the solder wettability of the coating even when the cladding is not followed by heat treatment or reflowing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile