The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Aug. 02, 2012
John Hyunchul Hong, San Clemente, CA (US);
Isak Clark Reines, San Diego, CA (US);
Chong Uk Lee, San Diego, CA (US);
Tallis Young Chang, San Diego, CA (US);
Yaoling Pan, San Diego, CA (US);
Edward Keat Leem Chan, San Diego, CA (US);
John Hyunchul Hong, San Clemente, CA (US);
Isak Clark Reines, San Diego, CA (US);
Chong Uk Lee, San Diego, CA (US);
Tallis Young Chang, San Diego, CA (US);
Yaoling Pan, San Diego, CA (US);
Edward Keat Leem Chan, San Diego, CA (US);
QUALCOMM MEMS Technologies, Inc., San Diego, CA (US);
Abstract
This disclosure provides systems, methods and apparatus for a thin film stack with surface-conditioning buffer layers. In one aspect, the thin film stack includes a plurality of thin film layers each having a thickness greater than about 10 nm and a plurality of surface-conditioning buffer layers each having a thickness between about 1 nm and about 10 nm. The surface-conditioning buffer layers are alternatingly disposed between the thin film layers. Each of the surface-conditioning buffer layers are formed with the same or substantially the same thickness and composition. In some implementations, the surface-conditioning buffer layers are formed by atomic layer deposition.